TSMC Plans to Increase CoWoS Monthly Output to 200 Thousand Wafers by 2027
According to Taiwan sources, TSMC intends to increase monthly CoWoS output from current 13 million wafers (end of 2026) to 20 million in 2027, and potentially to 24-26 million by end of 2027. Trajectory: 2024 — 30 thousand wafers, 2025 — 70 thousand, 2026 (by October) — 130 thousand. Demand for CoWoS (Chip-on-Wafer-on-Substrate) is critical for high-performance AI chips.
AI-processed from 36Kr (36氪); edited by Hamidun News
TSMC aggressively expands CoWoS packaging capacity to meet demand for artificial intelligence chips. According to supply chain data announced in July 2026, the company plans to achieve several capacity milestones.
Current and Future Production
Monthly output growth:
- 2024 — 30 thousand wafers
- 2025 — 70 thousand wafers
- 2026 (by October) — 130 thousand wafers
- 2027 (target) — 200 thousand wafers
The market is optimistic, expecting 240-260 thousand wafers per month by the end of 2027. CoWoS is critical for high-performance chips that require dense 3D crystal packaging.
Why This Matters for AI
Packaging capacity is a bottleneck in the AI chip supply chain. TSMC's production acceleration solves the shortage problem that has constrained the release of new accelerators for neural networks and LLM services. All new TSMC facilities operate 24/7.
What It Means
TSMC's capacity expansion signals that demand for AI chips remains strong and will grow at least through the end of 2027. This is a good sign for GPU manufacturers and specialized accelerator makers.
Want to stop reading about AI and start using it?
AI News is a curated feed of AI/tech news. Hamidun Academy teaches you to use AI systematically in your work.
The AI world, distilled — once a week
Seven stories that actually mattered, hand-picked. No noise, no reposts, no press releases.
Done! Check your inbox for a confirmation.